HGC MAC P2UG Silicon Modules 5 Nov 2024
https://indico.cern.ch/event/1471927/
Recall: Some layers can arrive too warped to laminate with epoxy alone. • Quality, specs, production rates, all at risk
• Path end: Established default procedures/materials.
• Focus is now on production ramp up.
Follow-ups
Links:
- ADHESIVES FOR MODULE STACKUP
- “Hybrid” adhesive method of lamination
- Because layers are not always flat: – Transfer tape was recommended
202411041329